TOOL TO REMOVE BONDED SEMICONDUCTOR WITH CHAMFER ON THE SEMICONDUCTOR CUTBACK
FUNCTION(S)
Cut / saw
Remove the outer sheath
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
DIAMETER
ø18 - 60 mm
ø0.709 - 2.362 in
TO DO WHAT
The CWB/18-60 enables the user to easily remove the bonded semi-conductor with a chamfer on the transition, leaving a very smooth finish over the insulation AND the CWB 18-60 works without silicone
PRODUCT BENEFITS
No silicon needed
Fine tuning of the blade with a 'click' for each 1/10 mm
Very smooth finish over the insulation
Adjustable length of semiconductor cutback : 25-30-40 mm / 0,984-1,181-1.575 in
THICKNESS CAPACITY
1,1 mm / 0,043 in
ANGLE OF THE CHAMFER ON THE SEMICONDUCTOR
8°
REMAINING LENGTH OF THE SEMICONDUCTOR
25-30-40 mm / 0,984-1,181-1,575 in